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Chemically Resistant adhesives
Parker Chomerics THERM-A-GAP™ GEL T630G Dispensable, Very Low Compression Force, Thermal Gap Filler
Categories: Polymer; Thermoset; Silicone

Material Notes: Description: THERM-A-GAP™ Gels are highly conformable, pre-cured, single-component compounds. The cross-linked gel structure provides superior long therm thermal stability and reliable performance. These unique materials result in much lower mechanical stress on delicate components than even the softest gap-filling sheets. They are ideal for filling variable gaps between multiple components and a common heat sink.

Features/Benefits: Dispensable; Fully cured; Highly conformable at low pressures; No refrigeration, mixing or filler settling issues in storage; Single dispensable TIM can eliminate multiple pad part sizes/numbers; RoHS Compliant and Reworkable

Typical Applications: Automotive electronic control unites (ECUs), engine control, transmission control, braking/traction control; Power conversion equipment; Power supplies and uninterruptible power supplies; Power semiconductors; MOSFET arrays with common heat sinks and Televisions and consumer electronics.

Product Attributes: Years of proven reliability in high-volume automotive applications; General use material; Good thermal performance; Lowest deflection force required; Minimal stress on components and “G” version has 0.010” glass beads as compression stops for electrical isolation.

Information provided by Chomerics

Vendors:
Available Properties
  • Specific Gravity, ASTM D792
  • Thickness, Bondline
  • Deformation, Modified ASTM C165, Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min
  • Deformation, Modified ASTM C165, Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min
  • Deformation, Modified ASTM C165, Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min
  • Deformation, Modified ASTM C165, Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min
  • Deformation, Modified ASTM C165, Dispensed 1.0 cc of material Brought 1" x 1" probe, Test rate 0.025 in/min
  • Outgassing - Total Mass Loss, ASTM E595
  • Volume Resistivity, ASTM D257
  • Dielectric Constant, ASTM D150
  • Dielectric Strength, ASTM D149
  • Dissipation Factor, Chomerics
  • CTE, linear, ASTM E831
  • Specific Heat Capacity, ASTM D1269
  • Thermal Conductivity, ASTM D5470
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Flammability, UL94
  • Shelf Life, Chomerics, From date of manufacture
  
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Manufacturer Notes:
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Category Notes
Plastic

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Chemically Resistant adhesives
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