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Master Bond adhesives
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic industries such as consumer, military, medical and optical/OEM.

Advantages & Application Notes:

  • Low viscosity resin allows for ease of pouring and potting into cavities with minimal void formation.
  • Special care should be used when mixing large masses.
  • Opaque black while maintaining its high insulation properties
  • Also, available in a thixotropic version called EPO-TEK® 509EBT-M1.
  • Compatible with dispensing, pouring and spin coating applications
  • Suggested Applications:
    • Optics: cutting of IR and VIS light in range of 300 to 2000 nm.
    • Electronics; potting cables and wires into connectors, electrically isolating pins of connectors
    • Semiconductor: a glob top over IC’s using the COB packaging format

Information Provided by Epoxy Technology

Vendors:
Available Properties
  • Specific Gravity, Part B
  • Specific Gravity, Part A
  • Viscosity, 100 rpm
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Lap
  • Shear Strength, Die
  • Volume Resistivity
  • Dielectric Constant
  • Dissipation Factor
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
  • Decomposition Temperature, Degradation Temperature
  • Transmission, Visible, Spectral
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Pot Life
  • Shelf Life
  
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Manufacturer Notes:
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Category Notes
Plastic

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