Resinlab® EP1385 Clear Epoxy Formulation

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Resinlab® EP1385 Clear Epoxy Formulation
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	Resinlab™ EP1385 Clear is an epoxy formulation designed for applications requiring resistance to E-85 type fuels. It has good wetting and adhesion to most surfaces. It has very good resistance to water, acids and bases and most organic solvents. The EP1385 Clear is a two part unfilled electronic grade epoxy encapsulating material designed for small to medium sized castings. It has a pot life of about one hour, cures quickly to a tack free handle strength at room temperature within 3 to 4 hours, and reaches a tough, semi-rigid state within 48 hours. Cure can be accelerated by the addition of heat. Times and temperatures from ½ hour at 100°C to 1 hour at 80°C or 4 hours at 50°C fill bring the product to full cure. Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Vendors:

Available Properties

Specific Gravity, TM R050-16, Part B
Specific Gravity, TM R050-16, Mixed
Specific Gravity, TM R050-16, Part A
Water Absorption, TM R050-35
Viscosity, TM R050-12, Part B, RVT, #2, 2.5 rpm
Viscosity, TM R050-12, Mixed
Viscosity, TM R050-12, Part A, RVT, #5, 2.5 rpm
Hardness, Shore D, TM R050-17
Tensile Strength at Break, TM R050-36
Tensile Strength, Ultimate, TM R050-36
Tensile Strength, Yield, TM R050-36
Elongation at Break, TM R050-36
Tensile Modulus, TM R050-36
Compressive Yield Strength, TM R050-38
Compressive Strength, TM R050-38, Ultimate
Compressive Strength, TM R050-38, Break
Compressive Modulus, TM R050-38
Adhesive Bond Strength, TM R050-37, Lap shear; 2024 T3 Al Abraded / MEK Wipe
Volume Resistivity
Dielectric Constant
Dielectric Strength
CTE, linear
Thermal Conductivity
Maximum Service Temperature, Air
Minimum Service Temperature, Air
Glass Transition Temp, Tg, TM R050-25
Transmission, Visible, clear; thickness not quantified
Pot Life, TM R050-19, Mass: 100g

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

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