| Product Description: EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a good adhesive sealant, with high peel strength and tensile lap shear. It has a very convenient mix ratio(1:1), weight or volume, and is serviceable over an exceptionally wide temperature range of -100 to 400°F. As a flexibilized system, it is an ideal adhesive for bond dissimilar substrates when thermal conductivity is needed. EP21TDCAOHT has superior thermal and mechanical shock resistance and is readily thermally cyclable. Product Advantages: - Convenient mixing: non-critical equal weight or volume ratio.
- Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly; no drip application feature.
- Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required.
- High shear and peel strength, ideal for dissimilar substrates.
- Good durability, thermal shock and chemical resistance.
- High thermal conductivity with excellent electrical insulation properties.
- Very wide service temperature range -100 to 350°F.
Information provided by MasterBond® |
