| AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. AA-BOND 2153 is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. AA-BOND 2153 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials. AA-BOND 2153 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals. Appearance: Dark Grey Cure Type: Heat cure or Room Temperature Benefits: - Strong
- Durable
- High impact bonds at room temperature
Mix Ratio by weight: 100:7/Resin:Hardener Typical Application: Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards Information provided by Atom Adhesives |
