| LORD CoolTherm™ MD-240 silver-filled conductive adhesive offers excellent thermal and electrical conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, power semiconductor and VLSI assembly. CoolTherm MD-240 adhesive is low stress, making it suitable for use with large die. CoolTherm MD-240 adhesive provides excellent adhesion to a wide variety of surfaces including silicon, silver, gold and copper. Low ionic levels make it ideally suited for demanding semiconductor and hybrid assembly applications. Features: may be applied by high-speed syringe dispensing, pin transfer or printing. provides a working life of up to 72 hours after loading a syringe into the dispensing equipment at room temperature; provides a working life of >12 hours when applied by pin transfer or printing methods. All information provided by Lord. |
