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Master Bond adhesives
Parker Chomerics CHO-SHIELD® 2056 Conductive Coating
Categories: Polymer; Adhesive; Thermoset

Material Notes: CHO-SHIELD® 2054 silver-plated-copper filled commercial-grade coating proved high levels of EMI shielding effectiveness, abrasion resistance and excellent adhesion on a variety of materials used for electronic enclosures.

Application: With their excellent leveling and uniformity, these coatings are compatible with all commercially available application technologies, including high volume/low pressure (HVLP) spray systems, and conventional propeller-agitated pressure pots. As low-settling compounds, they are ready for use after simple mixing in a paint shaker. They are supplied ready-to-spray, and don’t required additional thinning, although MEK can be used.

Information provided by Chomerics

Vendors:
Available Properties
  • Specific Gravity
  • Volatile Organic Compounds (VOC) Content
  • Thickness, Recommended
  • Surface Resistivity per Square
  • Shielding Effectiveness, TP08 Modified, 26 in. x 26 in. test panel
  • Shielding Effectiveness, TP08 Modified, 26 in. x 26 in. test panel
  • Shielding Effectiveness, TP08 Modified, 26 in. x 26 in. test panel
  • Shielding Effectiveness, TP08 Modified, 26 in. x 26 in. test panel
  • Shielding Effectiveness, TP08 Modified, 26 in. x 26 in. test panel
  • Shielding Effectiveness, TP08 Modified, 26 in. x 26 in. test panel
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time, Followed by 30 min @ 60°-71°C
  • Cure Time
  • Shelf Life
  
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Manufacturer Notes:
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Category Notes
Plastic

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