Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy

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Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive
Material Notes:	Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe. Advantages & Application Notes: Designed specifically to meet the requirements pertaining to MIL-STD 883/Test Method 5011 for military hybrids. Processing info: It can be applied by many dispensing, stamping and screen printing techniques. Dispensing: compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a single-component fashion. Screen Printing: best using >200 metal mesh, with polymer squeegee blade with 80D hardness. Stamping: small dots 6 mil in diameter can be realized. Misc / Other notes Many technical papers written over 30-40 year lifetime. Over 1 trillion chips attached at a single company: no failures, Six Sigma and Certified Parts Supplier award winner. Versatility in curing techniques including box oven, SMT style tunnel oven, heater gun, hot plate, IR, convection, or inductor coil. Information Provided by Epoxy Technology
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Available Properties

Specific Gravity, Part A
Specific Gravity, Part B
Particle Size
Viscosity, 100 rpm
Ionic Impurities - Na (Sodium)
Ionic Impurities - K (Potassium)
Ionic Impurities - Cl (Chloride)
Hardness, Shore D
Tensile Modulus, Storage
Shear Strength, Lap
Shear Strength, Die
Volume Resistivity
CTE, linear, Below Tg
CTE, linear, Above Tg
Thermal Conductivity, Based on standard method: Laser Flash
Thermal Conductivity, Based on Thermal Resistance Data: R = L x K^-1x A^-1
Maximum Service Temperature, Air, Continuous
Maximum Service Temperature, Air, Intermittent
Minimum Service Temperature, Air, Continuous
Minimum Service Temperature, Air, Intermittent
Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature, Degradation Temperature
Cure Time, Minimum Bond Line
Pot Life
Shelf Life

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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