Honeywell ACCUGLASS® T-14 314 Spin-on Glass

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Honeywell ACCUGLASS® T-14 314 Spin-on Glass
Categories:	Ceramic; Glass
Material Notes:	The Accuglass T-14 (κ = 3.8) Spin-on Glass (SOG) Series is a family of methyl-siloxane polymers used for interlevel and overcoat passivation in the manufacture of integrated circuits. The AccuglassT-14 series is specially formulated to fill narrow (down to 0.1µm) gaps without voids while planarizing multi-level metal devices. AccuglassT-14 contains 10wt% CH3 (methyl) groups bonded to Si atoms in the Si-O backbone. The specific formulation results in a stable dielectric constant, high crack resistance, excellent gap fill and planarization properties of the cured film.Thin films of AccuglassT-14 are applied using a commercial coater and cured in a vertical or horizontal furnace to thicknesses up to 3600Å (single coat) and 6000Å (double coat). Benefits Industry proven performance and broad acceptance T-14 fills gaps as small as 0.1µm High thermal stability. Compatible with hot aluminum and tungsten plug processing. Permeability allows for hydrogen annealing of gate oxides Thickness variation within a wafer of less than 1%. Wafer to wafer variation of less than 2% Lower dielectric constant compared to silicates and phosphorus silicates Crack resistance up to 6000Å Good adhesion to top and bottom dielectric layers Applications: ILD and PMD Planarization Overcoat Passivation Gapfill AccuglassT-14 is suitable for gap fill and planarization of ILD and PMD structures used in multilevel metal IC devices. Typically, partial etchback (PEB) is used for ILD and total etchback (TEB) is used for PMD. Information provided by Honeywell
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