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Chemically Resistant adhesives
Epoxy Technology EPO-TEK® B912-8 Epoxy
Categories: Polymer; Thermoset; Epoxy
Material Notes: Product Description: A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot-life of several days, low temperature cure and syringe dispensing rheology. It can be used for electrical connections when bonding chips, SMDs, PCBs and substrates.

Information Provided by Epoxy Technology
Vendors:
Available Properties
  • Specific Gravity
  • Particle Size
  • Viscosity, 20 rpm
  • Ionic Impurities - Na (Sodium)
  • Ionic Impurities - K (Potassium)
  • Ionic Impurities - Cl (Chloride)
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Lap
  • Shear Strength, Die
  • Volume Resistivity
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
  • Decomposition Temperature, Degradation Temperature
  • Pot Life
  • Shelf Life
  
Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

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Chemically Resistant adhesives



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