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Chemically Resistant adhesives
Rogers Arlon Thermabond® 99A90X008 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier
Categories: Polymer; Thermoset; Silicone; Silicone Rubber; Silicone, Molded, Glass Fiber Filled

Material Notes: Description: Primerless Thermabond®: Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.

Liner: FEP
Product: Uncured Silicone Rubber
Carrier: PTFE Coated Fiberglass

Product Advatages:
Bond Reliability – Bonds securely regardless of substrate type, shape, or texture.
Hot Spot Elimination – Thermal conductivity up to 3 W/mK to transport heat away from hot spots.
Thermal-Mechanical Stress Decoupling – Low modulus and high shear strength prevent adhesive delamination.
Low Temperature Cure Cycle – Thermabond® cure parameters can be as low as 100°C at 100 kPa, so surface mount components can be mounted on the PCB prior to bonding.
Uniform Bond Line Thickness – Precision calendering produces a uniform adhesive film.
Proven Performance – Arlon Thermabond® adhesive products are the gold standard for critical, demanding electronic system applications.

Product Use: Electrically insulating electronic adhesive. Bonds without primer.

Appearance: Gray, High viscosity gum on fluoropolymer release liners

This data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.

Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.

Available Properties
  • Density, Arlon SQA-TMS-024, Silicone Property
  • Thickness, Liner
  • Thickness, Carrier
  • Thickness, Arlon SQA-TMS-003, Overall
  • Hardness, Shore A, ASTM D2240, Silicone Property
  • Tensile Strength, ASTM D412, Silicone Property
  • Tensile Strength, Yield, Arlon SQA-TMS-008, Silicone Property
  • Elongation at Break, ASTM D412, Silicone Property
  • Poissons Ratio, Approximately, Silicone Property
  • Shear Modulus, ASTM D1002
  • Shear Strength, ASTM D1002, Lap Shear Strength
  • Dielectric Constant, IPC TM 650-, Dk, Silicone Property
  • Dielectric Strength, ASTM D149
  • Dissipation Factor, IPC TM 650-, Df, Silicone Property
  • CTE, linear, ASTM E 831, Silicone Property
  • Specific Heat Capacity, ASTM E 1952, Silicone Property
  • Thermal Conductivity, ASTM E 1530, Silicone Property
  • Thermal Conductivity, Arlon SQA-TMS-054, Product Property
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Glass Transition Temp, Tg, ASTM D3418, Silicone Property
  • Cure Time, Recommended Cure Cycle
  • Shelf Life, From date of manufacture
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Chemically Resistant adhesives
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