Design/Construction: Liner: FEPProduct: Uncured Silicone Rubber Carrier: PTFE Coated Fiberglass
Product Advatages: Bond Reliability – Bonds securely regardless of substrate type, shape, or texture.Hot Spot Elimination – Thermal conductivity up to 3 W/mK to transport heat away from hot spots.Thermal-Mechanical Stress Decoupling – Low modulus and high shear strength prevent adhesive delamination.Low Temperature Cure Cycle – Thermabond® cure parameters can be as low as 100°C at 100 kPa, so surface mount components can be mounted on the PCB prior to bonding.Uniform Bond Line Thickness – Precision calendering produces a uniform adhesive film.Proven Performance – Arlon Thermabond® adhesive products are the gold standard for critical, demanding electronic system applications.
Product Use: Electrically insulating electronic adhesive. Bonds without primer.
Appearance: Gray, High viscosity gum on fluoropolymer release liners
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Category NotesPlastic