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Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.
Lucas-Milhaupt HI-TEMPĀ® 095 Copper-Nickel-Manganese Filler Metal
Categories: Metal; Nonferrous Metal; Copper Alloy; Solder/Braze Alloy

Material Notes: Hi-Temp 095 is a ductile copper-nickel-manganese filler metal designed for intermediate temperature brazing of carbides, cast irons, steel, stainless steels and nickel base heat-resistant alloys. This filler metal is ideally suited for combined brazing/heat-treating. It is useful in the brazing of materials that may be harmed by the higher temperatures used in copper brazing. It also may be used to advantage in the brazing of materials that are subject to erosion and grain-boundary penetration associated with high boron (2% to 5%) brazing filler metals. This filler metal is relatively free flowing and will flow into long, narrow joints, except when solution of excessive amounts of nickel raises the liquids temperature.

Available forms: Wire, strip, engineered preforms, specialty preforms.

Information provided by Lucas-Milhaupt.

Available Properties
  • Specific Gravity
  • Density
  • Electrical Resistivity, 14.7% IACS
  • Melting Point
  • Solidus
  • Liquidus
  • Processing Temperature, Brazing Range
  • Copper, Cu, Remainder
  • Manganese, Mn, Remainder
  • Nickel, Ni
  • Other, total
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solder replacement adhesives
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