D2030506D3 low temperature cure dielectric is suitable for use as an insulating layer when printed onto untreated aluminum, glass or alumina substrates. It is compatible with a range of silver and carbon curing systems in order to construct simple circuits. This material gives a clear film when printed. These products are based on a unique curing process that results in the low temperature formation of a thermosetting insulation ink that combines good adhesion and insulation resistance with chemical, environmental and abrasion resistance. They offer the advantage of a One-Pack cure system combined with the convenience of ambient temperature stability and cure temperatures in the range of 130-180°C. Information provided by Gwent Electronic Materials Ltd. |