| Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used. Advantages & Application Notes: - Ease of use: smooth flowing paste allows for automated dispensing, stamping, brushing, or hand applications.
- Suggested applications include: EMI and Rf shielding; ITO interconnects in LCDs; low temperature cryogenic cooling.
- Exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.
- Hybrid/micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.
- Provides a metallic-like layer after cure.
Information Provided by Epoxy Technology |
