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Master Bond adhesives
Reltek BONDiT™ B-481 Adhesive, Sealant & Coating System
Categories: Polymer; Adhesive; Thermoset

Material Notes: Key Properties:
  • High strength and toughness with excellent thermal stability to 400°F.
  • Outstanding chemical resistance.
  • Excellent electrical, and mechanical properties.
  • Ease of use.

Applications: Encapsule sensitive instrumentation for chemical isolation, outstanding moisture resistance, ruggedness and flexibility. Suitable for clean room use and direct contact with semiconductors. Very easy to use and very clean two-part system. Superior for coating in marine applications and other harsh environments. Tough, high strength, chemically resistant non-blush clear coating with medium gloss finish. Bonds to most substrates. Can be applied to oily surfaces. Ambient 24 hour or accelerated thermal cure.

Key Words: Epoxy Adhesive, Sealant
Vendors:
Available Properties
  • Water Absorption, 24hrs boiling DI water
  • Viscosity
  • Tensile Strength at Break, 3 hrs @ 200°F; 2:1 Volume Mix
  • Tensile Strength, Ultimate, Peak; 3 hrs @ 200°F; 2:1 Volume Mix
  • Tensile Strength, Yield, 3 hrs @ 200°F; 2:1 Volume Mix
  • Elongation at Break, 3 hrs @ 200°F; 2:1 Volume Mix
  • Elongation at Yield, 3 hrs @ 200°F; 2:1 Volume Mix
  • Tangent Modulus, 3 hrs @ 200°F; 2:1 Volume Mix
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time, Ambient Set
  • Cure Time, Ambient, 95% cure
  • Cure Time, 98% cure
  • Tack-Free Time, Ambient
  • Pot Life, Ambient
  
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Manufacturer Notes:
Reltek LLC

Category Notes
Plastic

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