Epoxy Potting and Encapsulating Systems for Electronic Applications High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.
Cytec (Conap) FR-1046 / EA-87 Conapoxy® Resin / Conacure® Hardener A filled, non-abrasive, low viscosity, low shrinkage, low exotherm system with excellent resistance to thermal shock and very good electrical insulation properties. Low cost.
- Mix Ratio, Resin/Hardener (by weight): 100/18
Cure Type: Room Temperature Information provided by Cytec, subsequently acquired by Elantas. |