| Product Description: EPO TEK® H70E-2 is a two component, thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling. Advantages & Application Notes: - The epoxy exhibits resistance against moisture, contamination and solvents which make it an ideal glob top.
- A slightly thixotropic paste with excellent handling characteristics, pot life and short curing cycles. The rheology provides a dot-shape or dome configuration over wire-bonded die. Capable of glob-top DAM-and-FILL, or single-dot glob-top.
- Suitable for mass production as semiconductor encapsulant; low temp cure 80°C capable, controlled viscosity. Capable of many packages including TAB, COB, CSPs, BGAs, DIP and TO-cans.
- Excellent adhesion to PCB, ferrous and non-ferrous metals, glass, ceramic, epoxy package shells and semiconductor materials.
- Recommended for chip bonding, circuit repair, reinforce lead-frames, LSI chip packaging and good heat dissipation.
Information Provided by Epoxy Technology |
