| Molybdenum-copper composites (AMC) combine the unique properties of molybdenum with the high thermal conductivity of copper, resulting in a powerful metal matrix composite for thermal management. Molybdenum provides a very high melting point, low thermal expansion, and notable thermal conductivity, while copper’s exceptional heat transfer efficiency makes it effective for dissipating heat. Advantages: With a blend of mechanical and chemical properties, molybdenum-copper offers exceptional benefits for thermal management applications, including - High Thermal Conductivity: Advanced powder metallurgy composites deliver superior through-thickness thermal conductivity, outperforming competitive materials.
- High Ductility: Excellent ductility allows precise machining into complex shapes without compromising strength, making AMC ideal for intricate heat dissipation components. Our composites are also readily plateable.
- Excellent dimensional stability: With its excellent dimensional stability and corrosion resistance, the material ensures long product service life.
- Customized Thermal Expansion
Applications- Electronic packages
- Chip mounting
- Heat sinks
- Circuit board cores
- Thermal spreaders
Information provided by AMETEK Inc. |
