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Arlon Electronic Materials 51N Lead-Free Compatible Epoxy Low-Flow
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: 51N is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high reliability through lead-free solder operations. The high decomposition temperature and high thermal stability of this material is ideal for use in complex rigid-flex fabrication and assembly operations where minimum resin flow is required.

  • Decomposition Temperature > 350°C is ideally suited for lead-free solder processing and offers significant improvement over traditional FR-4 Epoxy systems.
  • Multifunctional epoxy resin system with a Glass transition temperature of 170°C thermal cycling PTH reliability
  • Improved bond adhesion over multiple thermal excursions results in better reliability through reflow and rework operations.
  • Electrical and mechanical properties meet the flow requirements of IPC-4101B/124 prepreg, modified to be low-flow.
  • Compatible with lead-free solder processing
  • RoHS/WEEE compliant

Typical Applications:

  • Bonding multilayer rigid-flex boards
  • Attaching heat sinks to finished PCB assemblies
  • Dielectric insulators
  • Other applications where minimal and uniform resin flow is required

    Information provided by ARLON Electronic Materials.

  • Vendors:
    Available Properties
    • Density, ASTM D792 Method A
    • Water Absorption, IPC TM-650
    • Tensile Strength, IPC TM-650
    • Modulus of Elasticity, IPC TM-650
    • Flexural Strength, IPC TM-650 2.4.4
    • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
    • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
    • Peel Strength, IPC TM-650, To Copper (1 oz./35 micron); At Elevated Temperatures
    • Volume Resistivity, IPC TM-650, C96/35/90
    • Volume Resistivity, IPC TM-650, E24/125
    • Surface Resistance, IPC TM-650, E24/125
    • Surface Resistance, IPC TM-650, C96/35/90
    • Dielectric Constant, IPC TM-650, may vary with resin %
    • Dielectric Constant, IPC TM-650, may vary with resin %
    • Dielectric Strength, IPC TM-650
    • Dissipation Factor, IPC TM-650
    • Dissipation Factor, IPC TM-650
    • Arc Resistance, IPC TM-650 2.5.1
    • CTE, linear, IPC TM-650 2.4.41
    • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, below Tg
    • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, above Tg
    • Thermal Conductivity, ASTM E1461
    • Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
    • Glass Transition Temp, Tg, IPC TM-650 2.4.25, DSC
    • Decomposition Temperature, IPC TM-650, Onset
    • Decomposition Temperature, IPC TM-650, 5 percent
    • Flammability, UL94
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