Arlon Electronic Materials 51N Lead-Free Compatible Epoxy Low-Flow

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Arlon Electronic Materials 51N Lead-Free Compatible Epoxy Low-Flow
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	51N is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high reliability through lead-free solder operations. The high decomposition temperature and high thermal stability of this material is ideal for use in complex rigid-flex fabrication and assembly operations where minimum resin flow is required. Decomposition Temperature > 350°C is ideally suited for lead-free solder processing and offers significant improvement over traditional FR-4 Epoxy systems. Multifunctional epoxy resin system with a Glass transition temperature of 170°C thermal cycling PTH reliability Improved bond adhesion over multiple thermal excursions results in better reliability through reflow and rework operations. Electrical and mechanical properties meet the flow requirements of IPC-4101B/124 prepreg, modified to be low-flow. Compatible with lead-free solder processing RoHS/WEEE compliant Typical Applications: Bonding multilayer rigid-flex boards Attaching heat sinks to finished PCB assemblies Dielectric insulators Other applications where minimal and uniform resin flow is required Information provided by ARLON Electronic Materials.
Vendors:

Available Properties

Density, ASTM D792 Method A
Water Absorption, IPC TM-650 2.6.2.1
Tensile Strength, IPC TM-650 2.4.18.3
Modulus of Elasticity, IPC TM-650 2.4.18.3
Flexural Strength, IPC TM-650 2.4.4
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Dielectric Constant, IPC TM-650 2.5.5.9, may vary with resin %
Dielectric Constant, IPC TM-650 2.5.5.3, may vary with resin %
Dielectric Strength, IPC TM-650 2.5.6.2
Dissipation Factor, IPC TM-650 2.5.5.3
Dissipation Factor, IPC TM-650 2.5.5.9
Arc Resistance, IPC TM-650 2.5.1
CTE, linear, IPC TM-650 2.4.41
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, below Tg
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, above Tg
Thermal Conductivity, ASTM E1461
Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
Glass Transition Temp, Tg, IPC TM-650 2.4.25, DSC
Decomposition Temperature, IPC TM-650 2.4.24.6, Onset
Decomposition Temperature, IPC TM-650 2.4.24.6, 5 percent
Flammability, UL94

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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