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Lab Instruments
Designer Molecules DMI-3006 Modified Polyimide based
Categories: Polymer; Adhesive

Material Notes: Warpage on silicon is generated through thermo-mechanical interactions of various organic materials with silicon during assembly process. The magnitude of warpage is effected by:1)difference of the CTE between Si and resin.2)modulus of resin.3)processing & curing temperatures. Warpage increases as wafer diameter gets larger & wafer thickness gets thinner. DMI-3006is `The super low-stress resin’ for buffer layer and other organic layers. It shows much lower tensile modulus and much lower cure temperature than conventional resins(Table.1).DMI-3006provides the benefits of a polyimide resin film without warpage (Fig.1).Other benefits of the material include very low moisture absorption, excellent electrical performance and enhanced adhesion to metals, especially copper. DMI-3006 can be used with a general photo resist process(Fig.2).

Information provided by Designers Molecules

Available Properties
  • Water Absorption, immersion
  • Moisture Absorption, 50% RH
  • Tensile Strength
  • Elongation at Break
  • Tensile Modulus
  • Dielectric Constant, IPC TM 650
  • Dissipation Factor, IPC TM 650
  • CTE, linear, a1
  • CTE, linear, a2
  • Glass Transition Temp, Tg
  • Decomposition Temperature, in air
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Elmet Technologies
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