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Chemically Resistant adhesives
Lord Adhesives Thermosetâ„¢ MD-200 Electrically Conductive Die-Attach Adhesive
Categories: Polymer; Adhesive

Material Notes: This is a system with the versatility to fit a wide variety of production and performance needs. The working life allows sufficient time for short production interruption. It can be initially cured at room temperature in 24 hours. Suitable for applications in which the part will not tolerate elevated temperatures. The cure schedule can also be shortened to 40 minutes by oven curing.
Intended Use: Chip-on-board die-attach.

All information provided by Lord.

Available Properties
  • Specific Gravity
  • Viscosity
  • Hardness, Shore D, ASTM D2240
  • Shear Strength, Chatillon Force Gauge Model DPP-25, Die; 0.05" x 0.05" IC
  • Shear Strength, ASTM D1002, Tensile
  • Thermal Conductivity
  • Glass Transition Temp, Tg, Perkin-Elmer DSC-2
  • Cure Time, Complete
  • Cure Time, Complete
  • Cure Time, Initial
  • Cure Time, Complete
  • Pot Life
  • Shelf Life, Resin
  • Shelf Life, Hardener
Property Data

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Chemically Resistant adhesives
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