Appearance: Transparent yellow film Product Benefits: - Enable fine pitch, narrow gap Cu Pillar
Cure: Heat cureApplication: Semiconductor, Films Typical Applications: Thermal Compression Bonding LOCTITE ABLESTIK NCF 218 transparent film is specially formulated for Pb free, low ?, thin gap, large and thin die used in advance flip chip applications. This material is suitable for die to die, die to wafer (TSV) or die to substrate applications. Information provided by Loctite® |