Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optical industries. Advantages & Application Notes: - Thixotropic nature provides a non-sag adhesive, with wet green strength prior to cure.
- Color change from tan to amber upon successful cure.
- Versatile adhesive to most plastics, ceramics, metals, and glass.
- Suggested Applications:
- PCB; Staking SMD devices to the PCB for double-sided assembly.
- Bonding of ferrites for power-devices.
Information Provided by Epoxy Technology |