Cookson Group Plaskon® 1031 Conventional Encapsulant

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Cookson Group Plaskon® 1031 Conventional Encapsulant (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. A low cost, conventional molding compound recommended for high volume commodity-type packages that house simple linear and discrete devices. These packages include low lead count DIPs, TO-types, diodes and small SOICs. Excellent moldability (fast curing, minimal if any deflashing, no degreasing); Superior cosmetics and markability
Vendors:

Available Properties
Density Viscosity, Automatic orifice Viscosity Spiral Flow, 177°C/1000 psi Hardness, Shore D Flexural Strength Flexural Modulus Dielectric Constant Dielectric Strength Dissipation Factor Arc Resistance CTE, linear CTE, linear, Transverse to Flow Thermal Conductivity Glass Transition Temp, Tg Flammability, UL94 Flammability, UL94 Processing Temperature, Molding temperature

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

**
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