Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy

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Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly. Advantages & Application Notes: A pot life of at least one day is mass production friendly and convenient for consecutive manufacturing shifts. Its thixotropic nature allows for dispensing “domes or hemispheres” directly over the IC without the need for using a dam or cavity to control flow. Suggested Applications: Semiconductor: Glob top encapsulant for COB die attach. Plastic semiconductor package filling instead of traditional epoxy transfer molding compound. Electronic/PCB: general protection of SMDs. Opto-electronics: black and opaque epoxy for adhesive and sealing applications while blocking IR and VIS light. In some cases, it is advantageous to pre-warm the epoxy < 50°C in order to decrease its thixotropic nature, while increasing capillary and flow rate. Low CTE makes it ideal for keeping stresses to a minimum. Information Provided by Epoxy Technology
Vendors:

Available Properties

Specific Gravity, Part A
Specific Gravity, Part B
Particle Size
Viscosity, 50 rpm
Hardness, Shore D
Tensile Modulus, Storage
Shear Strength, Lap
Shear Strength, Die
Volume Resistivity
Dielectric Constant
Dissipation Factor
CTE, linear, Below Tg
CTE, linear, Above Tg
Thermal Conductivity
Maximum Service Temperature, Air, Continuous
Maximum Service Temperature, Air, Intermittent
Minimum Service Temperature, Air, Continuous
Minimum Service Temperature, Air, Intermittent
Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature, Degradation Temperature
Transmission, Visible
Transmission, Visible
Transmission, Visible
Cure Time, Minimum Bond Line
Cure Time, Minimum Bond Line
Pot Life
Shelf Life

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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