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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.
Master Bond EP21TDCSMED Two Component, Silver Filled, Electrically Conductive USP Class VI Epoxy Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy, Thermally Conductive

Material Notes: Key Features:
  • USP Class VI certified
  • Electrically conductive
  • Thermally conductive
  • Cures at room temperature or elevated temperatures
  • Cryogenically serviceable
Product Description: Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/ sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems, the EP21TDCSMed has a one to one mix ratio, by weight or volume. It readily develops a high bonding strength of more than 1,800 psi tensile shear and a T-peel of greater than 20 pli when measured and cured at 75°F . It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is less than 10-3 ohm-cm. Master Bond Polymer System EP21TDCSMed can be applied with minimal sagging or dripping even on vertical surfaces although it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent (xylene, acetone, MEK, etc.) by weight. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of 4K to +275°F enabling it to be serviceable even in cryogenic applications. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Parts A and B are both colored silver. Master Bond EP21TDCSMed is widely used in medical electronic applications where biocompatibility issues are of paramount importance, e.g. implants.

Product Advantages:

  • Convenient mixing: one to one ratio by weight or volume
  • Contains no volatiles; excellent low outgassing properties
  • Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly
  • High bond strength to similar and dissimilar substrates
  • Superior durability, thermal shock and chemical resistance
  • Much less rigid than conventional silver epoxy

Information provided by Master Bond Inc.

Vendors:
Available Properties
  • Hardness, Shore D
  • Adhesive Bond Strength, After 30 days water immersion
  • Adhesive Bond Strength, Tensile lap, Aluminum to Aluminum
  • Peel Strength
  • Volume Resistivity
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Cure Time
  • Working Life, After mixing, 50 gram batch
  • Shelf Life, in original, unopened containers
  • USP Class VI
  
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Manufacturer Notes:
Master Bond Inc.

Category Notes
Plastic

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USP Class VI adhesives
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