Appearance: Silver Cure: Heat cure Product Benefits: - Excellent adhesion
- Low moisture in cavity
- Low weight loss during cure
- Low ionic impurities
- High reliability
- Minimal voiding
- Electrically conductive
- Thermally conductive
Application: Die attach Filler Type: Silver Substrates Alumina, Gold plated alumina and Heat Sinks Typical Package Application: VLSI packages, Solder sealed ceramic packages and Solder sealed hermetic packaging LOCTITE ABLESTIK JM 7000 die attach adhesive has been formulated for use in high throughput die attach applications. This material has been used successfully on rigid substrates with die sizes up to 700 mils. LOCTITE ABLESTIK JM 7000 has been approved by DESC and Rome Laboratory for military products. Information provided by Loctite® |