Product Highlights:- High purity silver conductive
- Tremendous toughness
- Cryogenic service
- Exceptional peel strength
- Superior thermal conductivity
- Withstands severe shocks
Kohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. It offers low volume resistivity (< 10-3 ohm-cm) and high thermal conductivity. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1031 AT-S can withstand severe thermal cycling, shocks and vibrations even at cryogenic temperatures. It offers an extensive service temperature range of 4K (-269.15°C) to +135°C. It offers outstanding physical strength properties and peel strength. KB 1031 AT-S adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. It offers chemical resistance to a variety of fuels, oils and water. Part A and Part B have a silver - gray color. KB 1031 AT-S can be applied with minimal dripping; however, it can be made more flowable by adding 5 - 10% of solvent like acetone or xylene. KB 1031 AT-S is widely used in electronics, microwave, aerospace, semiconductor among various industries. Typical Applications: Information provided by Kohesi Bond Custom Engineered Adhesives |
