| Description: Chomerics’ family of thin heat spreaders provides a low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks are inappropriate. T-Wing spreaders consist of 5oz. [0.007inch/0.18mm thick] flexible copper foil between electrically insulating films. High strength silicone PSA (pressure-sensitive adhesive) provides a strong bond to the component. The compliant nature of these “thermal wing” heat spreaders permits nearly 100% adhesive contact with non-flat package surfaces, optimizing thermal and mechanical performance. Features/Benefits: Component junction temperature reduction of 10-20°C is common, Easily added to existing designs to lower component temperatures and improve reliability, Custom shapes available for complex designs, Used where localized sensitivity to EMI (electromagnetic interference) exists, Low profile, and Peel and stick application. Typical Applications: Microprocessors, Memory modules, Laptop PC’s and other high density, hand held portable electronics, and High speed disk drives. Information provided by Chomerics |
