Henkel Loctite® ABLESTIK QMI519 Adhesive

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Henkel Loctite® ABLESTIK QMI519 Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Silver Cure: Heat cure Product Benefits: Electrically conductive Thermally conductive One component Ease of use Void-free bondline Hydrophobic Stable at high temperatures High resistance to delamination Good resistance to "popcorning" after exposure to reflow temperatures Cure: Heat cure Application: Die attach Key Substrates: Wide variety of metals and ceramic surfaces, Copper, Silver, Palladium and Alloy 42 Typical Package Application: SOIC, SOP, QFP and QFN type packages LOCTITE ABLESTIK QMI519 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder. Information provided by Loctite®
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Available Properties

Specific Gravity
Moisture Absorption, 168 hrs, 85% RH exposure
Viscosity, Uncured, Speed 5 rpm
Tensile Modulus, Cured, Young's
Shear Strength, Die, 300 X 300 mil, 1 mil bondline thickness Ag plated Cu
Volume Resistivity, Cured
CTE, linear, Cured, alpha1
CTE, linear, Cured, alpha2
Thermal Conductivity
Glass Transition Temp, Tg, Cured
Cure Time, Skip Cure Process
Cure Time, Alternative Cure Schedule 1
Cure Time, Alternative Cure Schedule 2
Shelf Life, Uncured, from date of manufacture

Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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