Product Benefits:
Application: Die attach
Filler Type: Silver
Key Substrates: PPF, Copper and Silver
LOCTITE ABLESTIK 8200C electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
This page displays only the textof a material data sheet.To see MatWeb's complete datasheet for this material (includingmaterial property data, metalcompositions, material suppliers,etc), please click the button below.
Category NotesPlastic