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Master Bond adhesives
Phosphorus-Deoxidized, Low Residual Phosphorus, UNS C12100, OS050 Temper, Shapes
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: Nominal Grain Size 0.050 mm

Fabrication Properties: Excellent Suitability – Soldering, Brazing, Gas Shielded Arc Welding, Capacity for Being Cold Worked, Capacity for Being Hot Formed; Good Suitability – Butt Weld; Fair Suitability – Oxyacetylene Welding

Common Fabrication Processes: Blanking, Coining, Coppersmithing, Drawing, Etching, Forming and Bending, Heading and Upsetting, Hot Forging and Pressing, Piercing and Punching, Roll Threading and Knurling, Shearing, Spinning, Squeezing and Swaging, Stamping

Typical uses: Building Fronts; Downspouts; Flashings; Gutters; Screening; Applications Requiring Brazing; Applications Requiring Weldability; Busbars (Welded or Brazed); Contacts; Electrical Conductors; Switches; Terminals; Tubular Bus; Anodes; Ball floats; Chemical Process Equipment; Conductors, Resistance Welding Equipment; Vats

Applicable Specifications: ASTM B224; Bands - Projectile Rotating MILITARY MIL-B-20292; Brazing Filler Metal – FEDERAL QQ-B-650

Vendors:
Available Properties
  • Density
  • Hardness, Rockwell B
  • Hardness, Rockwell F
  • Tensile Strength
  • Tensile Strength, Yield, 0.5% Ext
  • Elongation at Break
  • Tensile Modulus
  • Modulus of Rigidity
  • Poissons Ratio, Calculated
  • Machinability
  • Forgeability
  • Shear Strength
  • Electrical Resistivity, 98% IACS
  • CTE, linear
  • CTE, linear
  • CTE, linear
  • Specific Heat Capacity
  • Thermal Conductivity
  • Melting Point
  • Annealing Point
  • Hot-Working Temperature
  • Copper, Cu
  • Phosphorus, P
  • Silver, Ag
  
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