| Product Description: EPO-TEK® H77 Black is a two component, thermally conductive, electrically insulating epoxy system designed for lid sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic. Advantages & Application Notes: - Very high temperature epoxy. Coatings on metals have been subjected to temperatures as high as 260°C without bond failure. It can also resist >300°C processes found in ceramic or hermetic packaging.
- Rheology provides a soft, smooth, flowing paste with excellent handling characteristics. Its low viscosity nature allows it to be poured or cast into shape for potting applications. It is compatible with automated dispense equipment, screen printing or stamping techniques.
- Excellent solvent and chemical resistance. Excellent for harsh chemical environments found in aircraft, under-hood automotive, medical and petrochemical refineries like down-hole applications.
- It provides near hermetic seals in the packaging of MEMs devices, such as pressure sensors or accelerometers, packaged in TO-cans.
- Suggested for ultra-high vacuum applications.
- It can be also be used for sealing of optical filter windows found in scientific OEM or sensor devices.
Information Provided by Epoxy Technology |
