Cookson Group Plaskon® ULS-12LA Molding Compound

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Cookson Group Plaskon® ULS-12LA Molding Compound (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. An ultra low stress, low alpha emission molding compound designed for packaging stress-sensitive memory devices such as TSOPs and large QFPs. It offers an alpha particle count of <0.001 counts/cm2/hour and uranium/thorium levels of 0.5 to 0.8 ppb. Ultra low stress properties; Low moisture absorption; Outstanding moldability (good mold filling, low wire sweep, fast cycles and good hot hardness); Superior reliability
Vendors:

Available Properties

Density
Water Absorption
Viscosity, Automatic orifice Viscosity
Linear Mold Shrinkage
Spiral Flow
Hardness, Shore D
Flexural Strength
Flexural Modulus
Dielectric Constant
Dielectric Strength
Dissipation Factor
Arc Resistance
CTE, linear
CTE, linear, Transverse to Flow
Thermal Conductivity
Glass Transition Temp, Tg
Flammability, UL94
Flammability, UL94
Processing Temperature, Molding temperature

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

**
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