Cookson Group STAYCHIP® 3105 Low Stress Underfill for Large Die Flip Chip

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Cookson Group STAYCHIP® 3105 Low Stress Underfill for Large Die Flip Chip (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy
Material Notes:	STAYCHIP™ 3105 is an aromatic amine-cured epoxy underfill, designed for low stress and exceptional adhesion to common solder-mask and die passivation surfaces, even after exposure to elevated heat, pressure, and humidity. This material provides superior adhesion even after accelerated environmental conditioning. This fast flow underfill was formulated for penetration of gaps below 1 mil. When fully cured, the material displays excellent reliability in thermal cycle performance. It is easily dispensed and also exhibits low moisture absorption for improved JEDEC performance. Flip chip devices assembled with StaychipTM 3105 exhibit extremely low warpage and high radii of curvature to minimize induced stresses on fragile die architectures. Features: Minimal induced die stress Low Package Warpage Excellent Reliability in Thermal Cycling Low Moisture Absorption Exceptional Adhesion (even after exposure to high humidity, pressure, and temperature) Fast, Efficient Flow Properties Passes JEDEC Level 3/260°C flip chips up to 15mmx15mm size Information provided by Cookson Electronics
Vendors:

Available Properties

Specific Gravity, ASTM D 792-00
Filler Content
Moisture Absorption at Equilibrium, ASTM D5229/D 5229M-92 (1998) e1. D 570-98, 24 hour boil
Particle Size
Viscosity, ASTM D2196-99, Haake RS1
Storage Temperature
Hardness, Shore D, ASTM D 2240-03
Fracture Toughness, ASTM D5045-99
Adhesive Bond Strength, DIN EN 60749-20, Shear strength to polyimide passivated Die, 75 micron gap, at 200°C
Adhesive Bond Strength, DIN EN 60749-19, Shear strength to polyimide passivated Die, 75 micron gap, at 25°C
CTE, linear, Alpha 1
CTE, linear, Alpha 2
Glass Transition Temp, Tg, ASTM D3418-99, By DSC
Flash Point, ASTM D 93-02
Pot Life, ISO 10364:1993, Time to double viscosity
Shelf Life

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

**
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