| Description: THERMFLOW® phase-change Thermal Interface Materials (TIM) are designed to minimize the thermal resistance between power dissipating electronic components and heat sinks. This low thermal resistance path maximizes heat sink performance and improved component reliability. At room temperature, THERMFLOW® materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. THERMFLOW® material softens as it reaches component operation temperatures. With light clamping pressure it will readily conform to both mating surfaces. This ability to completely fill interfacial air gaps and voids typical of component packages and heat sinks allows THERMFLOW® pads to achieve performance superior to any other thermal interface materials. THERMFLOW® products are electrically non-conductive. However, since metal-to-metal contact is possible after the material undergoes phase-change in a typical heat sink assembly. In general, THERMFLOW® pads should not be used as electrical insulators –PC07DM-7 is offered as a dielectric version. Typical Applications: Microprocessors, Graphics Processors, Chipsets, Memory Modules, Power Modules, Power Semiconductors. Product Attributes: Excellent thermal performance; Inherently tack-no adhesive required; Ideal for vertical applications; Sticky nature limits flowing in vertical applications and Tabs available for easy removal Information provided by Chomerics |
