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Metal adhesives
Aptek 2312-PMF Electrically conductive, low modulus adhesive
Categories: Polymer; Adhesive; Thermoset

Material Notes: Premixed-frozen, electrically conductive, low modulus adhesive
APTEK 2312-PMF is a one component, premixed-frozen, silver filled, electrically conductive soft paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. APTEK 2312-PMF is a 100% solid, solvent free system that will not form voids during cure or outgas after being fully cured.

Premixed-frozen and packaged in syringes for convenient dispensing to circuit board; Low modulus to minimize stress to sensitive components and ceramic substrates; Low Tg for excellent low temperature cycling and performance; Excellent substrate adhesion, superior to silicones; Available with spacer beads for precise bond line control

Information provided by Aptek Laboratories, Inc.

Available Properties
  • Density, ASTM D1475
  • Outgassing - Total Mass Loss, Cured property; at 10E-6 torr; ASTM E-595
  • Collected Volatile Condensable Material, Cured property; at 10E-6 torr; ASTM E595
  • Adhesive Bond Strength, Al-to-Al Lap Shear; Cured property, scuff sanded, IPA wiped T3-202Al; cohesive failure; ASTM D1002
  • Volume Resistivity, Cured property; ASTM D257
  • Thermal Conductivity, COLORA
  • Glass Transition Temp, Tg, Cured property; JMTP P-200
  • Flash Point, ASTM D92
  • Processing Temperature, Cure 3 hrs
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Metal adhesives
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