| Product Description: EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. Also available in a single component frozen syringe. This is an increased thermal conductivity version of EPOTEK® H20E. Advantages & Application Notes: - Processing info - it can be applied by many dispensing, stamping and screen printing techniques.
- Dispensing: compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a singlecomponent fashion.
- Screen Printing: best using >200 metal mesh with polymer squeegee blade with 80D hardness.
- Stamping: small dots 6 mil in diameter can be realized.
- Misc /Other notes:
- Versatility in curing techniques including box oven, SMT style tunnel oven, heater gun, hot plate, IR, convection, or inductor coil.
- Suggested applications:
- LED – HB LED industry; light engines for HD-TV; LCD color projection.
- Solar, die-attach epoxy for CPV chips onto ceramic carriers; thermal epoxy for ceramic to aL finned heat sink.
Information Provided by Epoxy Technology
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