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Master Bond adhesives
Henkel Loctite® ECCOBOND FP4460 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black

Cure: Heat Cure

Product Benefits:

  • High purity
  • Low stress
  • Improved work life
  • High temperature performance
  • Excellent chemical resistance
  • Excellent moisture resistance
  • High flow
Application: Encapsulant - glob top

Filler Type: Silica

Typical Package Application: Automotive applications, IC memory cards, Chip carriers, Hybrid circuits, Chip-on-board, Multi-chip modules, BGA and Pin grid arrays

LOCTITE ECCOBOND FP4460 encapsulant is designed for protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type.

Information provided by Loctite®

Available Properties
  • Specific Gravity
  • Filler Content
  • Brookfield Viscosity, Spindle 7, speed 10 rpm
  • Brookfield Viscosity, Spindle 7, speed 4 rpm
  • CTE, linear, Cured, Below Tg
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Glass Transition Temp, Tg, Cured, by TMA
  • Shrinkage, Cured
  • Cure Time
  • Gel Time
  • Shelf Life, from date of manufacture
Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes

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