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Atom Adhesives AA-BOND 2104 Epoxy Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: AA-BOND 2104 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristic. AA-BOND 2104 solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics. AA-BOND 2104 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties. AA-BOND 2104 provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds.

Appearance: Milky, Translucent

Cure Type: Heat cure or Room Temperature


  • Great for aerospace applications
  • Great for reinforcing applications
  • Bonds to many substrates
Mix Ratio by weight: 100:22/Resin:Hardener

Substrates: metals, glass, ceramics, wood and many plastics

Typical Application: PCB components, aerospace, anything where superior properties are required, staking components, bonding, laminating, repair applications

Information provided by Atom Adhesives

Available Properties
  • Specific Gravity, uncured
  • Solids Content, uncured
  • Hardness, Shore D
  • Izod Impact, Notched
  • Volume Resistivity
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • CTE, linear
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Cure Time
  • Pot Life, uncured
  • Shelf Life, uncured
Property Data

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Rulon Bearings
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