Product Highlights:- Superb abrasion resistance
- Excellent flow properties
- Castable up to 3 inches depth and more
- Outstanding chemical resistance
- Cryogenic serviceability
- Capable of passing NASA low outgassing
Kohesi Bond KB 1452 HT-2CRSC is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 100:40 (Part A: Part B) mix ratio by weight. It offers excellent abrasion resistance and an extremely low coefficient of thermal expansion (CTE). The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. Rapid cures are achievable with a straight heat cure as well at elevated temperatures. KB 1452 HT-2CRSC offers an extensive service temperature range of 4K (-269.15°C) to +200°C. It offers outstanding physical strength properties and dimensional stability. KB 1452 HT-2CRSC adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers excellent chemical resistance to a variety of organic and inorganic acids, solvents, alkali, aromatic hydrocarbons, oils and water. Additionally it is capable of passing NASA standards for low outgassing (ASTM E-595). Owing to its high abrasion resistance and cryogenic serviceability, KB 1452 HT-2CRSC is widely used in electronics, aerospace, semiconductor and various OEM applications. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
