Park Aerospace Nelco® N4000-11 BC® Buried Capacitance™ Epoxy Laminate and Prepreg

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Park Aerospace Nelco® N4000-11 BC® Buried Capacitance™ Epoxy Laminate and Prepreg
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	The Nelco® N4000-11 is a CAF resistant, high Tg (175º C by DSC) multifunctional epoxy dielectric substrate. This material is formulated to provide the PWB manufacturer and OEM with vastly improved thermal, mechanical, and electrical performance in lead-free assembly and high layer count, sophisticated PWB designs. The Nelco N4000-11 BC® is offered as a buried capacitance solution, offering a greater degree of design freedom for smaller, more reliable assemblies. Key Features and Benefits: Tg >175ºC, thermal stability and moisture resistance CAF Resistant Low Z-axis expansion Dicyandiamide (DICY) free, proprietary resin chemistry Superior electrical properties Buried Capacitance Solution Optimized FR-4 processing Applications/Qualifications: High Density Interconnects Lead-Free Assembly Substrate Large Format Backplanes Tight Tolerance Via to Via Applications High I / O Count BGA Substrates Extreme Layer count Multilayers Lead-Free DCA Applications High Temperature Underhood Automotive Telecommunications Infrastructure Sophisticated Data Storage Applications RoHS Compliant Meets IPC-4101/28, /83, /98, /99 Specifications Information provided by Park Electrochemical Corp.
Key Words:	EP
Vendors:

Available Properties

Density, 50% Resin Content; Internal Method
Water Absorption, IPC-TM-650.2.6.2.1
Peel Strength, IPC-TM-650.2.4.8.2a, at elevated temperature
Peel Strength, IPC-TM-650.2.4.8, after exposure to process solutions
Peel Strength, IPC-TM-650.2.4.8, after solder float
Dielectric Constant, IPC-TM-650.2.5.5.9, RF Impedance
Dielectric Constant, IPC-TM-650.2.5.5.5, Stripline
Dielectric Constant, IPC-TM-650.2.5.5.3, TFC/LCR Meter
Dielectric Strength, IPC-TM-650.2.5.6.2
Dissipation Factor, IPC-TM-650.2.5.5.5, Stripline
Dissipation Factor, IPC-TM-650.2.5.5.3, TFC/LCR Meter
Specific Heat Capacity, ASTM E1461-92
Thermal Conductivity, ASTM E1461-92
Glass Transition Temp, Tg, IPC-TM-650.2.4.24c, TMA
Glass Transition Temp, Tg, IPC-TM-650.2.4.25c, DSC
Decomposition Temperature, IPC-TM-650.2.4.24.6, 5% weight loss; TGA
Flammability, UL94

Property Data

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Manufacturer Notes:
Park Aerospace, former Park Electrochemical Corp.

Category Notes
Plastic

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