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Master Bond adhesives
Kohesi Bond TUF 1828 TC One component, toughened, low thermal resistance epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Product Highlights:
  • Unrivaled heat transfer efficiency
  • Cryogenic service
  • Superb mechanical strength properties
  • Microns thin bond lines achievable
  • Capable of passing NASA low outgassing
  • Unlimited working life at room temperature
Kohesi Bond TUF 1828 TC is a toughened, single component, thermal management epoxy system that offers an unlimited working life at room temperature. This product has very low thermal resistance and can be applied in layers as thin as 10 microns. The efficiency of heat transfer improves exceedingly with lower thermal resistance. Since TUF 1828 TC can be applied in 10 micron thick sections, it offers a notably low thermal resistance of 5 - 6 × 10-6 m2•K/W. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides superior bonding and physical strength properties. It has a gray color. Owing to its sensational thermal management properties and low outgassing properties TUF 1828 TC is widely used in electronics, optical, aerospace, specialty OEM and cryogenic industries.

Typical Applications:

  • Bonding
  • Sealing

Information provided by Kohesi Bond Custom Engineered Adhesives

Vendors:
Available Properties
  • Hardness, Shore D
  • Tensile Strength
  • Compressive Strength
  • Adhesive Bond Strength, Tensile Lap Shear, Al/Al
  • Peel Strength, Al/Al
  • Dielectric Constant
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Cure Time, Post Cure
  • Shelf Life, in original unopened containers
  
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Category Notes
Plastic

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