Parker Chomerics Tecknit TeckBond™-C Silver-Plated Copper-Filled Adhesive

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Parker Chomerics Tecknit TeckBond™-C Silver-Plated Copper-Filled Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Description: TECKBOND-C is a silicone rubber base filled with silver-plated copper particles to produce a highly conductive one-component adhesive sealant. The system is an RTV moisture-cured compound which is ready to use without additional preparation or mixing. The compound cures at room temperature to form a flexible resilient conductive bond or sealant. Application Information: TECKBOND conductive adhesive-sealants are recommended wherever a flexible bond is required in a metal-to-silicone gasket application, such as TECKNIT CONSIL®-C. These adhesives are recommended in applications where the bond thickness is less than 0.016 in. [0.4 mm]. To ensure optimum bond performance, the surface of the metal may require priming Information provided by Chomerics
Vendors:

Available Properties
Shear Strength, ASTM D1002, Cured Peel Strength, ASTM D1876, Silicone Aluminum; Cured Volume Resistivity, QA-1038, 50% RH; Cured Maximum Service Temperature, Air, Cured Minimum Service Temperature, Air, Cured Shrinkage, Cured Cure Time, 50%; Recommended for 1/8" dia bead Cure Time, 50%; Full Cure Shelf Life, Unopened Container

Property Data

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Category Notes
Plastic

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