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Metal adhesives
Parker Chomerics Tecknit TeckBond™-C Silver-Plated Copper-Filled Adhesive
Categories: Polymer; Adhesive

Material Notes: Description: TECKBOND-C is a silicone rubber base filled with silver-plated copper particles to produce a highly conductive one-component adhesive sealant. The system is an RTV moisture-cured compound which is ready to use without additional preparation or mixing. The compound cures at room temperature to form a flexible resilient conductive bond or sealant.

Application Information: TECKBOND conductive adhesive-sealants are recommended wherever a flexible bond is required in a metal-to-silicone gasket application, such as TECKNIT CONSIL®-C. These adhesives are recommended in applications where the bond thickness is less than 0.016 in. [0.4 mm]. To ensure optimum bond performance, the surface of the metal may require priming

Information provided by Chomerics

Available Properties
  • Shear Strength, ASTM D1002, Cured
  • Peel Strength, ASTM D1876, Silicone Aluminum; Cured
  • Volume Resistivity, QA-1038, 50% RH; Cured
  • Maximum Service Temperature, Air, Cured
  • Minimum Service Temperature, Air, Cured
  • Shrinkage, Cured
  • Cure Time, 50%; Recommended for 1/8" dia bead
  • Cure Time, 50%; Full Cure
  • Shelf Life, Unopened Container
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Metal adhesives
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