MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 155,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
Flame Retardant adhesives
Caplinq LINQTAPE ™ PIT0.5S-UT 0.5 mil polyimide film with ultra-thin 0.5 mil silicone adhesive
Categories: Polymer; Adhesive; Thermoset; Polyimide, TS

Material Notes: LINQTAPE™ PIT0.5S-UT-Series is a high-temperature resistant polyimide tape. It combines our 0.5-mil (13 micron) thick polyimide film– the generic equivalent of DuPont® Kapton™ HN tape – with an ultra-thin 0.5mil silicone pressure adhesive, while still having excellent adhesion and mechanical strength at high temperatures. LINQTAPE™ PIT0.5S-UT-Series is designed for both permanent and temporary bonding in many high temperature applications. These applications can be found in semiconductor, smartcard, electronic, automotive and general manufacturing industries. LINQTAPE™ PIT0.5S-UT-Series provides an excellent balance of electrical, mechanical, thermal, and chemical properties over a wide range of temperatures. It can be used in applications that may see temperatures up to 260°C (500°F). LINQTAPE™ PIT0.5S-UT-Series comes in 33 meter (36 yard) rolls of varying widths. LINQTAPE PIT-S polyimide films with silicone adhesive are available in a range of thicknesses, starting from 0,5 mil (12.7µm) thickness and up. Custom thicknesses are available upon request.


  • High adhesion to wide range of substrates
  • Ideal for wafer dicing and die cutting
  • Temporary bonding of thermocouples for oven profiling
  • Bonding of devices prior to solder reflow
  • Splicing of Insulation layers
  • Masking in high temperature powder applications
  • Gold finger masking
  • Insulating circuit boards and coils
  • Wave solder masking tape
  • Insulation wrapping of coils, transformers and capacitors.

Information provided by Caplinq

Available Properties
  • Thickness, Film (Backing)
  • Thickness, Adhesive Thickness (±10-15% tolerance)
  • Thickness, Total
  • Elongation at Break
  • Tear Strength
  • Peel Strength, to steel
  • Dielectric Strength
  • Maximum Service Temperature, Inert
  • Flammability, UL94, Polyimide Backing
Property Data

This page displays only the text
of a material data sheet.

To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
), please click the button below.

Manufacturer Notes:

Category Notes

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.


Flame Retardant adhesives
Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2022 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.