Arlon Electronic Materials 84N Polyimide Laminate and Prepreg

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Arlon Electronic Materials 84N Polyimide Laminate and Prepreg
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	84N is a high performance ceramic-filled polyimide prepreg based on Arlon's 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper layers and for filling clearance holes in metal cores. The ceramic filler in the resin serves to reduce shrinkage and inhibit crack formation during through-hole drilling in filled clearance areas. High Tg polyimide (>250°C) with Thermal Decomposition temperature (Td) >400°C and T300>60 minutes Low z-expansion of 1% between 50-250°C offers superior PTH reliability through manufacture, assembly and in service Up to 50% or more reduction in cure time compared with traditional polyimide cycles Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41 Toughened, Non-MDA chemistry resists drill cracking Halogen-free chemistry Compatible with lead-free solder processing RoHS/WEEE compliant Typical Applications: MLB's that are designed with clearance holes in metal cores or for thick metal powder and ground planes that require the thermal stability of polyimide Applications requiring significant lifetimes at elevated temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive applications, industrial sensor systems and burn-in testing of IC's. Information provided by ARLON Electronic Materials.
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Available Properties

Density, ASTM D792 Method A
Water Absorption, IPC TM-650 2.6.2.1
Modulus of Elasticity, IPC TM-650 2.4.18.3
Poissons Ratio, ASTM D3039
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Dielectric Constant, IPC TM-650 2.5.5.3, may vary with resin %
Dielectric Strength, IPC TM-650 2.5.6.2
Dissipation Factor, IPC TM-650 2.5.5.3
Arc Resistance, IPC TM-650 2.5.1
CTE, linear
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, below Tg
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, above Tg
Thermal Conductivity, ASTM E1461
Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
Decomposition Temperature, IPC TM-650 2.3.41, Initial
Decomposition Temperature, IPC TM-650 2.3.41, 5 percent
Flammability, UL94

Property Data

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Category Notes
Plastic

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