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Metal adhesives
Henkel Loctite® ABLESTIK QMI536HT Paste
Categories: Polymer

Material Notes: Appearance: Pink

Filler Type: Boron Nitride

Cure: Skip-Cure Process or Heat Cure

Product Benefits:

  • Electrically non-conductive
  • Hydrophobic
  • Stable at high temperatures
  • Void-free bondline
  • Excellent interfacial adhesion strength
  • Good resistance to "popcorning" after exposure to reflow temperatures
  • Excellent dielectric properties
Application: Die attach

Typical Package Application: PBGA, Array packages, Tape packs and CSP

Typical Applications: Heat sinks, Heat slugs and Flip Chip

Surface Finishes: Solder Mask, BT, FR, Au, Silicon, Polyimide, Kapton™, Palladium, Alloy 42 and Mylar™

LOCTITE ABLESTIK QMI536HT die attach paste was designed to attach integrated circuits and components to advanced substrates.

Information provided by Loctite®

Vendors:
Available Properties
  • Specific Gravity
  • Moisture Absorption, 168 hrs, 85% RH
  • Brookfield Viscosity, Uncured, Speed 5 rpm
  • Tensile Modulus, Cured
  • Volume Resistivity, Cured
  • Dielectric Constant, Cured
  • CTE, linear, Cured, Below Tg
  • CTE, linear, Cured, Above Tg
  • Thermal Conductivity, Cured
  • Glass Transition Temp, Tg, Cured
  • Cure Time, Skip Cure Process, at bondline
  • Cure Time, Snap Cure Schedule, at bondline
  • Cure Time, Tunnel Oven configured with hot gas or IR, at bondline
  • Cure Time, Conventional Oven, at bondline
  • Shelf Life, Uncured
  
Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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Metal adhesives
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