| Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Advantages & Application Notes: - Snap cure adhesive or fast-cure; chips can be cured in-line < 90 seconds travel time; or lead-frames can be loaded into magazines for box oven curing <15 minutes travel time at 180°C or higher; a traditional box-oven cure for several hours may also be used.
- Excellent adhesion to die-paddle on lead-frames including Cu, Alloy 42, or Ag spot ring.
- Bright and shiny silver epoxy after cure; suggested for LED die-attach packaging.
- Compatible with COB die-attach process on Au plated PCB, Au plated ceramic PCB in hybrid packages or opto-electronic packaging using hybrids.
- 24 hour pot-life for automated syringe dispensing; compatible with many dispensing methods: air pressure, positive displacement, and auger screws.
- Soft and creamy thixotropic behavior. Rheology allows for high speed dispensing of dots, dot arrays, shower head dispensing, or the writing-pen method.
- Suggested for JEDEC Level II packaging of semiconductor devices
Information Provided by Epoxy Technology |
