Parker Chomerics CHO-BOND® SV713 Conductive Epoxy

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Parker Chomerics CHO-BOND® SV713 Conductive Epoxy
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive
Material Notes:	CHO-BOND® 700 Series Adhesives for Microelectronics Packaging; these pure silver-filled epoxy pastes are designed to meet the demanding requirements of semiconductor and microelectronic packaging. They are one-component systems with a unique combination of excellent die shear strength, low coefficients of thermal expansion, ionic purity, and high thermal and electrical conductivities. Each offers and extended working life with viscosity and thixotropy suitable for both time/pressure and positive displacement dispensing methods. CHO-BOND® SV713 is especially well suited for temperature-sensitive, high performance applications. Information provided by Chomerics
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Available Properties
Specific Gravity Volatile Organic Compounds (VOC) Content Solubility in Water, Insoluble Thickness, Recommended Shear Strength, Lap Shear Strength, Die Volume Resistivity Maximum Service Temperature, Air Minimum Service Temperature, Air Flash Point Cure Time Cure Time Working Life Shelf Life Silver, Ag

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Plastic

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