| Description: CHO-BOND® 500 Series Adhesive/Sealant Compounds; These pure silver-filled materials are used where tight tolerances require thin bond lines. Various cure cycles are available, and the materials are formulated for easy application by caulking gun, spatula, needle spotting, or silk screening. Their use for bonding mesh gaskets, printed circuit board repair, chip bonding, rear window defogger repair, and as low-temperature-activated flexible solders demonstrates their versatility. CHO-BOND® 592 adhesive bonds dissimilar materials effectively. It combines long pot-life and excellent adhesion with low viscosity, a low coefficient of thermal expansion, very low thermal impedance and good thermal shock resistance. The material excels as a sealant for microwave modules and components and is useful for circuit board repair and grounding applications.Information provided by Chomerics |
